Microelectronics Assembly Technologies, Inc. ("MAT") is a provider of advanced multichip module and assembly technologies for the electronics industry. MAT was formed in January 2006 and is based in Research Triangle Park, North Carolina. MAT enables higher performance semiconductor modules through reduced thickness and better thermal exhaust. MAT's expertise is in the areas of materials, electrical, thermal and advanced assembly of semiconductors.
MAT's mission is to successfully commercialize its new broad based Multi-Chip Module technology for high speed, high density electronics. Additionally, MAT offers assembly services for high-end electronics with low temperature budgets and requirements. MAT currently holds eight US and two foreign patents, has six patent applications, and additional provisional patents for its technologies.